This heat sink compound is  an extremely thermally conductive grease used to improve the thermal conductivity between irregular metal surfaces. It has been designed for applications where maximum heat flow is a must. It has a non-silicone oil base, and it is extremely stable under temperature cycling. Additionally, it is free of metallic fillers and therefore does not present the capacitance issues common with other silver filled high end thermal greases. Use when overclocking CPU’s and in other electronic applications where heat flow is critical.