Lead Free

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MG CHEMICALS Structural Epoxy Adhesive, 9200-25ML

Toughened, smooth, thixotropic paste 1:1 mix ratio Working life: 30 minutes Cure time: 24 hours at room temperature Non-sagging and gap filling Very strong adhesion Bonds dissimilar materials Highly resistant to vibration and temperature cycling Extreme chemical resistance Low shrinkage Easy to dispense

MG CHEMICALS Low Temperature Solder Paste T3 SN42/BI57/AG1, 4902P-15G

Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B Excellent fine pitch printing capability Long operational life - non-slumping Good wettability

VELLEMAN Lead Free Solder .04" Diameter 99.3 TIN/.7 CU, Rosin Core, SOLD100GLF

Weight: 0.22 lbs Width: .04" diameter Composition: 99.3% SN - 0.7% Cu Melting point: 446F Rosin core